LOCTITE® 382 is a high viscosity, single component instant adhesive formulated for electronics. It delivers a fast fixture within 20 to 40 seconds and cures through humidity to form strong bonds across metals, plastics and rubbers. The kit includes an optional accelerator for instant tacking in sensitive applications.
Viscosity: 4 000–8 000 mPa·s at 25 °C (Brookfield RVT)
Fixture time: 20–40 seconds (steel) with humidity cure; under 5 seconds with accelerator plus light tack
Cure: humidity activated; accelerator part of kit enhances surface cure
Specific gravity: 1.05 at 23.9 °C
Shear strength: ≥ 7 N/mm² (1 015 psi) on steel substrates ()
Dielectric strength: 25 kV/mm
Operating temperature: –65 °C to +210 °F (~99 °C)
Gap fill capacity: up to 0.2 mm (~0.008 in)
Primary Chemistry:
Ethyl cyanoacrylate
LOCTITE® 382 is tailored for electronics assembly tasks such as wire tacking to coil forms, tamper proofing adjustable components and securing standoffs or rigid supports on circuit boards. Its gel like viscosity ensures precise placement without bleed through, while its ethyl cyanoacrylate chemistry enables strong adhesion to diverse substrates. The product is supplied with LOCTITE® 7452 accelerator to achieve surface bonding in seconds, while humidity cure finalises the bond in blind or shaded areas. High dielectric strength (25 kV/mm) and excellent thermal stability support reliable performance in electrical systems. It is suitable for applications requiring rapid processing, reliable bond integrity and durability in moderate environmental conditions.
Viscosity: 4 000–8 000 mPa·s at 25 °C (Brookfield RVT)
Fixture time: 20–40 seconds (steel) with humidity cure; under 5 seconds with accelerator plus light tack
Cure: humidity activated; accelerator part of kit enhances surface cure
Specific gravity: 1.05 at 23.9 °C
Shear strength: ≥ 7 N/mm² (1 015 psi) on steel substrates ()
Dielectric strength: 25 kV/mm
Operating temperature: –65 °C to +210 °F (~99 °C)
Gap fill capacity: up to 0.2 mm (~0.008 in)
Primary Chemistry:
Ethyl cyanoacrylate
Eliminates the need for mechanical fasteners on small or delicate parts
Prevents undesired movement or adjustment in potentiometers, sensors or fine electronics
Reduces assembly errors and improves throughput in electronics manufacturing
Supports strong bonding without risk of damage to nearby components or signal loss
Ideal for wire tacking, component stiffening or tamper proofing in electronics and coil applications
Apply bead to substrate, position components and fixture instantly with accelerator spray
Allow humidity cure to complete full bond strength in concealed areas over 24 hours
Suitable for use on metal, plastic and rubber parts, with no primer required
Supports high reliability tasks in power electronics, motor windings and sensor assemblies
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